USA USD Eng Process Engineer Intermediate
Position Details:
Job title: Eng - Process Engineer
Duration: 12 -month contract
Work Location: Santa Clara, CA
Pay rate:$44.44 - $53.33/hr. on W2.
Job ID: #(phone number removed)
Experience: 1-2 Years
Key Responsibilities
Design, collect data, analyze and compile reports on process engineering experiments for defect reduction, within safety guidelines
Troubleshoot defect problems, perform Root Cause Analysis and resolve moderately difficult process engineering issues
Implement new technology, products and analytical instrumentation to support the defect study
Design the failure analysis (FA) DOE for the key defect critical components to troubleshoot the wafer defect issue on the key R&D programs and major customer escalations
Perform the FA, collect and analyze the data within safety guidelines
Communicate the FA observation and recommend the solution path in defect troubleshooting
Measure the wafer defect/film properties, organize data/reports for review in supporting the defectivity improvement by SEM/FIB
Prepare wafers for experimentation, include cleaning, loading wafers. Prepare klarf files. Evaluate and recommend performance of process system.
Operate scanning electron microscope (SEM) for top view or critical dimension and energy dispersive spectroscopy (EDS) analysis / imaging pending on job assignment, identify all of patterns of interest, understand image quality requirement and sample/beam interaction to determine optimized condition.
Prepare samples for Focused Ion Beam (FIB) lamella making by utilizing Zeta Marking tool and optimize sample prep procedure and conditions, identify cutting location based on pattern instructions.
Operate and check performance of equipment to perform sample prep process, under limited supervision
Understand the Scanning Electron Microscope (SEM) and Focused Ion Beam (FIB) principle.
Operate Focused Ion Beam (FIB) for making TEM lamella pending on job assignment, identify all of patterns of interest, understand lamella quality requirement and sample/beam interaction to determine optimized conditions.
Perform SEM/FIB system software alignment functions. Perform routine maintenance procedures, flash, plasma clean etc.
Perform routine shut down procedure. Identify problem put tool down and call for service.
Coordinates instrument repair and maintenance. Coordinates with engineering on wafer evaluations.
Orders equipment and supplies, and coordinates with vendors and purchasing.
Orders equipment and supplies, and coordinates with vendors and purchasing.
Coordinates with engineering on wafer evaluations. Sets up equipment for experiments.
Perform routine shut down procedure. Identify problem put tool down and call for service.
Report and communicate the wafer defect analysis result, recommend the solution path for wafer defect troubleshooting on key R&D programs
Interact with vendors/suppliers to evaluate/troubleshoot the latest defect metrology tools (SEM, EDX, FIB, Wafer scribing)
Develop and publish best known method (BKM) procedures including, sample prep, scanning electron microscope (SEM) conditions, and special sample handling.
Generate internal documentation for products, presentations and technical reports
Provide trainings for junior engineers for wafer preparation/analysis on defect metrology tools
Contribute and manage the Metrology tool (Zeta/SEMVision) operation
Interface with requestors, understand their detail requirement, and communicate on results;
Help lab on monitoring wafer in process (WIP) and maintaining quality, turnaround time, and throughput.
Define and forecast the defect metrology tool requirement to support N+ defect requirement
Host the defect knowledge sharing forum, internal workshop/conference
Regards,
Lekhana Yathiraj
Senior Technical Recruiter
Office: (phone number removed)
Artech Information Systems LLC
360 Mt. Kemble Avenue., Suite 2000, Morristown, NJ 07960
Email: (url removed), Website: (url removed)
Job title: Eng - Process Engineer
Duration: 12 -month contract
Work Location: Santa Clara, CA
Pay rate:$44.44 - $53.33/hr. on W2.
Job ID: #(phone number removed)
Experience: 1-2 Years
Key Responsibilities
Design, collect data, analyze and compile reports on process engineering experiments for defect reduction, within safety guidelines
Troubleshoot defect problems, perform Root Cause Analysis and resolve moderately difficult process engineering issues
Implement new technology, products and analytical instrumentation to support the defect study
Design the failure analysis (FA) DOE for the key defect critical components to troubleshoot the wafer defect issue on the key R&D programs and major customer escalations
Perform the FA, collect and analyze the data within safety guidelines
Communicate the FA observation and recommend the solution path in defect troubleshooting
Measure the wafer defect/film properties, organize data/reports for review in supporting the defectivity improvement by SEM/FIB
Prepare wafers for experimentation, include cleaning, loading wafers. Prepare klarf files. Evaluate and recommend performance of process system.
Operate scanning electron microscope (SEM) for top view or critical dimension and energy dispersive spectroscopy (EDS) analysis / imaging pending on job assignment, identify all of patterns of interest, understand image quality requirement and sample/beam interaction to determine optimized condition.
Prepare samples for Focused Ion Beam (FIB) lamella making by utilizing Zeta Marking tool and optimize sample prep procedure and conditions, identify cutting location based on pattern instructions.
Operate and check performance of equipment to perform sample prep process, under limited supervision
Understand the Scanning Electron Microscope (SEM) and Focused Ion Beam (FIB) principle.
Operate Focused Ion Beam (FIB) for making TEM lamella pending on job assignment, identify all of patterns of interest, understand lamella quality requirement and sample/beam interaction to determine optimized conditions.
Perform SEM/FIB system software alignment functions. Perform routine maintenance procedures, flash, plasma clean etc.
Perform routine shut down procedure. Identify problem put tool down and call for service.
Coordinates instrument repair and maintenance. Coordinates with engineering on wafer evaluations.
Orders equipment and supplies, and coordinates with vendors and purchasing.
Orders equipment and supplies, and coordinates with vendors and purchasing.
Coordinates with engineering on wafer evaluations. Sets up equipment for experiments.
Perform routine shut down procedure. Identify problem put tool down and call for service.
Report and communicate the wafer defect analysis result, recommend the solution path for wafer defect troubleshooting on key R&D programs
Interact with vendors/suppliers to evaluate/troubleshoot the latest defect metrology tools (SEM, EDX, FIB, Wafer scribing)
Develop and publish best known method (BKM) procedures including, sample prep, scanning electron microscope (SEM) conditions, and special sample handling.
Generate internal documentation for products, presentations and technical reports
Provide trainings for junior engineers for wafer preparation/analysis on defect metrology tools
Contribute and manage the Metrology tool (Zeta/SEMVision) operation
Interface with requestors, understand their detail requirement, and communicate on results;
Help lab on monitoring wafer in process (WIP) and maintaining quality, turnaround time, and throughput.
Define and forecast the defect metrology tool requirement to support N+ defect requirement
Host the defect knowledge sharing forum, internal workshop/conference
Regards,
Lekhana Yathiraj
Senior Technical Recruiter
Office: (phone number removed)
Artech Information Systems LLC
360 Mt. Kemble Avenue., Suite 2000, Morristown, NJ 07960
Email: (url removed), Website: (url removed)
