Staff Process Engineer Electroplating and CMP
Job Description
- Manufacturing engineer owner of wet processes (Electroplating and CMP) in magnetic recording head wafer fabrication.
- Responsible for statistical process control (SPC) of process, chemistries, and tool parameters (film composition & thickness, deposition / removal rates, pressure, temperature, chemical concentration, pH, etc.).
- Responsible for optimizing process performance (ensure uniform deposition or removal of metal/dielectric materials), maintain process margin.
- Conduct failure analysis for process/tool deviations that result in defects and affect wafer quality.
- Participate in the introduction of new processes/materials into manufacturing and take ownership to maintain these under good control and to achieve maturity.
- Participate in the introduction and qualification of new Wet process equipment for capacity improvement or technology advancement.
